LEAD-Free Soldering Challenge.
The higher melting point and wetting characteristics of lead-free soldering has made the traditional process windows narrower. Also the PCB must be able to handle four extreme heat cycles (Bottom-side SMT, Top-side SMT, WaveSoldering, Rework/Repair) without degradation to the circuit board and components. LACE provides expertise to minimize peak temperature and to optimize the process for high quality soldering.
