Range of Services

  • Surface mount technology
  • Through-hole
  • Mixed technologies
  • Electrical assemblies
  • Cable assemblies
  • Sub-assemblies
  • Final assembly
  • Testing & calibration
  • SMT capabilities include 0201 chip to 50mm square BGA component range
  • 20 in. by 20 in. large board placement area.
  • Conformal coating & potting
  • Procurement services
  • Full turnkey & consignment production
  • Prototype
  • High mix/medium volume production
  • Functional test
  • Component level troubleshoot & repair
  • Circuit design and layout services
  • Design from concept
  • Reverse & redesign from sample
  • Re-generate lost gerber files
  • Circuit board layout, DFM & RoHs compliance.
  • Test and burn-in
  • Sub-assembly manufacturing
  • Cable and harness manufacturing
  • Mechanical assembly
  • Rework to customer existing product
  • Hand insertion

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